An electrical circuit is formed by forming and patterning a conductive layer
on
a substrate, forming and patterning a conductive layer on another substrate, depositing
a dielectric layer on at least a portion of one of conductive layers, mounting
an integrated circuit (IC) between the substrates, coupling the IC to the conductive
layers, and affixing the substrates together with the conductive layers between
the substrates. These are either separate substrates or a unitary substrate. The
IC is mounted either to a substrate, a conductive layer, or a dielectric layer.
The IC is coupled to the conductive layers either directly or through openings
formed in the dielectric layer. An interior conductive layer may be used to couple
the IC to the conductive layers.
