A light emitting die package and a method of making the light emitting die package
are disclosed. The die package includes a stem substrate having grooves, a wire
lead attached to the grooves, and a light emitting diode (LED) mounted on the stem
substrate. Also coupled to the substrate are a sleeve, a reflector, and a lens.
To make the light emitting die package, a long substrate is formed and wire leads
attached to the substrate. Then, the substrate including the attached wire leads
is cut to predetermine lengths to form individual stem substrates. To each stem
substrate, LED, reflector, and lens are coupled.
