An automatic sensing wafer blade for picking up wafers that is equipped with a
sensor capable of self-diagnosing potential failure conditions of the blade and
a method for using the wafer blade are described. The automatic sensing wafer blade
is equipped with a V-shaped seal ring on a top surface, and a sensor of either
a limit switch or a capacitance sensor for sensing the presence or absence of a
wafer on top of the wafer blade. The automatic sensing wafer blade is further capable
of self-diagnosing any potential failure conditions of the function of the wafer
blade due to contaminating particles, or contaminating liquid on the wafer surface,
or due to an aged or malfunctioning seal ring on top of the wafer blade.
