A substrate treating apparatus disclosed herein realizes improved throughput.
The
substrate treating apparatus according to this invention includes an antireflection
film forming block, a resist film forming block and a developing block arranged
in juxtaposition. Each block includes chemical treating modules, heat-treating
modules and a single main transport mechanism. The main transport mechanism transports
substrates within each block. Transfer of the substrates between adjacent blocks
is carried out through substrate rests. The main transport mechanism of each block
is not affected by movement of the main transport mechanisms of the adjoining blocks.
Consequently, the substrates may be transported efficiently to improve the throughput
of the substrate treating apparatus.
