a composition for film formation which can be cured in a short time period and
give a film having a low dielectric constant and excellent in heat resistance,
adhesion and cracking resistance, a polymer for use in the composition and a process
for producing the polymer. The composition prepared by dissolving the polymer having
specific repeating units in a solvent has excellent film-forming properties. The
polymer has repeating units represented by the following general formula (1):
##STR1##
wherein Z and Y are as defined hereinabove.
