A method and system for cutting a wafer comprising a conductive substrate
attached to an array of integrated devices includes placing the wafer on a
stage such as a movable X-Y stage including a vacuum chuck having a porous
mounting surface, and securing the wafer during and after cutting by
vacuum pressure through the pores. The wafer is cut by directing UV pulses
of laser energy at the conductive substrate using a solid-state laser. An
adhesive membrane can be attached to the separated die to remove them from
the mounting surface, or the die can otherwise be removed after cutting
from the wafer.
