The present invention discloses a method including: determining whether a
surface of a dielectric layer is reactive; activating the surface if the
surface is not reactive; performing a cycle on the surface, the cycle
including: reacting the surface with a metal; and activating the metal.
The present invention also discloses a structure including: a substrate; a
first interlayer dielectric located over the substrate; a first adhesion
promoter layer located over the first interlayer dielectric; an etch stop
layer located over the first adhesion promoter layer; a second adhesion
promoter layer located over the etch stop layer; and a second interlayer
dielectric located over the second adhesion promoter layer.
