Solder, method for processing surface of printed wiring board, and method for mounting electronic part

   
   

A solder consists essentially of 1.0% to 4.0% of Ag by mass, 0.2% to 1.3% of Cu by mass, 0.02% to 0.06% of Co by mass, and the remaining of Sn and inevitable impurities.

Une soudure consiste essentiellement en 1.0% à 4.0% d'AG par la masse, 0.2% à 1.3% du Cu par la masse, 0.02% à 0.06% de Co par la masse, et le restant du Sn et des impuretés inévitables.

 
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