A plurality of interdigitized conductive fingers are arranged to form a substantially square configuration in each of a plurality of layers separated by a high dielectric constant material, wherein each of the plurality of interdigitized conductive fingers includes at least one bend of substantially ninety degrees. The plurality of interdigitized conductive fingers includes a first set of fingers that are connected to an anode terminal, and a second set of fingers that are connected to a cathode terminal. The plurality of layers includes a bottommost layer that is in closest proximity to a substrate relative to other layers of the plurality of layers. The bottommost layer does not include any fingers connected to the anode terminal.