An easily disassembling cooling apparatus is assembled onto a circuit board. The circuit board has an electronic element. The cooling apparatus includes a pair of fastening blocks, one or two heat conducting blocks, a heat pipe, a fastening plate, and a plurality of locking elements. The fastening blocks are fastened onto the circuit board and each has a track slot. The heat conducting block is installed between the fastening blocks and contacts the electronic element. One end of the heat pipe is installed with the heat conducting block. The fastening plate is installed in the track slots of the fastening blocks, and has a flexible arm that flexibly presses onto the heat pipe. Each of the locking elements respectively is combined with the fastening block. Thereby, the welding process is not required in the assembling process. The electronic element is reliably cooled, and the assembling time is reduced.