A copper-based alloy that has the soundness of alloy enhanced by
restraining the concentrated occurrence of microporosities while
suppressing the lead content and an ingot and a liquid-contacting part
using the alloy are provided. The copper-based alloy has the soundness of
alloy improved during the course of solidification of the copper-based
alloy by crystallizing an intermetallic compound capable of solidifying
at a temperature exceeding a solidus line in dendritic gaps of the alloy,
suppressing migration of a solute, thereby allowing dispersion of
microporosities, utilizing crystallization of the intermetallic compound
as well for effecting dispersed crystallization of a low melting metal or
a low melting intermetallic compound capable of solidifying at a
temperature falling short of a liquidus line, and relying on the low
melting metal or low melting intermetallic compound to enter the
microporosities and suppress occurrence of microporosities.