When a package substrate with a built-in capacitor includes a first
thin-film small electrode 41aa and a second thin-film small electrode
42aa that are electrically short-circuited to each other via a pinhole P
in a high-dielectric layer 43, a power supply post 61a and a via hole 61b
are not formed in the first thin-film small electrode 41aa, and a ground
post 62a and a via hole 62b are not formed in the second thin-film small
electrode 42aa, either. As a result, the short-circuited small electrodes
41aa and 42aa are electrically connected to neither a power supply line
nor a ground line, and become a potential independent from a power supply
potential and a ground potential. Therefore, in the thin-film capacitor
40, only the portion where the short-circuited small electrodes 41aa and
42aa sandwich the high dielectric layer 43 loses the capacitor function,
and portions where other thin-film small electrodes 41a and 42a sandwich
the high dielectric layer 43 maintain the capacitor function.