The invention relates to a radiation crosslinkable hot melt pressure sensitive adhesive comprised of a radiation crosslinkable polymer as component (A) based on epoxidized polyolefins, wherein the epoxy groups are not consolidated in blocks; a tackifying resin possessing no epoxy groups as component (B); optionally a low molecular weight oligomer as component (C) that possesses reactive groups that can react with the epoxy groups of component (A); and an additive comprising a photo initiator as component (D).