An integrated circuit leadless package system includes forming a lead, attaching an integrated circuit die to the lead, and applying an encapsulant including a thin encapsulant region with a thinner section over the lead than a section over the integrated circuit die.

 
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< Bonding method for through-silicon-via based 3D wafer stacking

> Chip package structure

> Semiconductor device, fabrication method therefor, and film fabrication method

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