A method for fabricating a wireless pressure sensor includes providing a first substrate. A portion of the first substrate is controllably displaced to form a cavity. A conducting material is patterned on the first substrate to form a first capacitor plate and a first inductor. A second substrate is provided. A conducting material is patterned on the second substrate to form a second capacitor plate. The second substrate is attached to the first substrate to seal the cavity such that at least a portion of the second substrate is movable with respect to the first substrate within the cavity in response to a change in an external condition. A hermetically sealed capacitive pressure sensor may reside in the cavity between the first substrate and second substrate.

 
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