A semiconductor device has a substrate with an electronic circuit, a
semiconductor element provided at a first surface of the substrate and
electrically connected by wire bonding to the electronic circuit, a
metallic core layer electrically connected to the semiconductor element.
A plurality of conductive bumps provided opposite the first surface of
the substrate. A thermal hardenable resin seals at least the
semiconductor element, and a metal plate is electrically connected to the
metal core layer.