A semiconductor device includes a substrate, a semiconductor chip flip-chip mounted on the substrate, a sealing resin layer sealing the surroundings of the semiconductor chip, and a heat sink bonded to the sealing resin layer through a TIM layer. In addition, a cooling medium is encapsulated in an enclosed space formed on the rear surface of the semiconductor chip.

 
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> Copper alloys and liquid-crystal display device

> Microcircuit package having ductile layer

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