A high heat-resistance resin composition, the high heat-resistance resin
composition being thermally treated at 150.degree. C. for 100 hours,
wherein a heat absorption amount of the high heat-resistance resin
composition which is measured at a melting point thereof by Differential
Scanning Calorimetry (DSC) is equal to or less than 45 J/g before thermal
treatment, an increasing rate of the heat absorption amount of the high
heat-resistance resin composition which is measured at a melting point
thereof after the thermal treatment by Differential Scanning Calorimetry
(DSC) is equal to or less than 20% as compared to that before the thermal
treatment, and a degree of extensibility thereof is equal to or more than
200% after the thermal treatment.