Substrates having integrated rigid and flexible regions and methods of fabricating such substrates are disclosed. The substrates may advantageously be used for mounting semiconductor chips used in flexible microelectronic assemblies.

 
Web www.patentalert.com

< Conductive structures including titanium-tungsten base layers

> Stacked redistribution layer (RDL) die assembly package

> Solder structures for out of plane connections

~ 00578