A conductive ink composition for inkjet printing, more particularly to a conductive ink composition for inkjet printing, which includes 30 to 85 parts by weight of metal nanoparticles, 10 to 60 parts by weight of an organic solvent, 10 to 30 parts by weight of a humectant, the humectant made of a diol or glycol base compound, and 0.1 to 10 parts by weight of an ethylene glycol-based ether compound additive for adjusting viscosity. The ink composition may be optimized, such that the viscosity of the ink may be adjusted while maintaining a high concentration of metal, when forming wiring using an inkjet device, for improved flow and ejection properties of the ink.

 
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