The invention relates to a dicing die-bonding film having a pressure-sensitive adhesive layer and a die bonding adhesive layer being sequentially laminated on a supporting substrate, wherein said pressure-sensitive adhesive layer has a thickness of 10 to 80 .mu.m, and has a storage elastic modulus at 23.degree. C. of 1.times.10.sup.4 to 1.times.10.sup.10 Pa.