Disclosed is an apparatus and process within a pass-by sputtering chamber, in which standard cathodes and two or more specially-sized cathodes within the sputtering chamber, mounted colinear with the direction of travel of substrates within the sputtering chamber, enabling performance of rapid adjustment of material deposited on a substrate.

 
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< TRIM MAGNETS TO ADJUST EROSION RATE OF CYLINDRICAL SPUTTER TARGETS

> SPUTTER CATHODE APPARATUS ALLOWING THICK MAGNETIC TARGETS

> TWO-ZONE ION BEAM CARBON DEPOSITION

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