A Field Emission Device (FED) and its method of manufacture includes: forming a substrate; forming a cathode having a cathode aperture on an upper surface of the substrate; forming a material layer having a first through hole with a smaller diameter than that of the cathode aperture on an upper surface of the cathode; forming a first insulator having a first cavity on an upper surface of the material layer; forming a gate electrode having a second through hole on an upper surface of the first insulator; and forming an emitter in a central portion of the cathode aperture.

 
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< Protective film structure

> System and method for detecting the displacement of a plurality of micro- and nanomechanical elements, such as micro-cantilevers

> Ultra thin seed layer for CPP or TMR structure

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