The present invention is linear polyethylene composition suitable for use as a heat seal resin, wherein the resin comprises: (a) from about 70 wt % to about 90 wt % of a linear polyethylene having a density of from about 0.88 to about 0.92 g/cm.sup.3; (b) from about 0 wt % to about 30 wt % of a copolymer of ethylene and an .alpha.,.beta.-unsaturated carboxylic acid and/or an ionomer thereof; and, (c) from about 2 wt % to about 10 wt % of a tackifier.