In one embodiment, a head assembly to be adapted about a solid immersion lens includes a plurality of jets configured in a radial pattern that extends from a central portion to a substantial periphery of the head assembly. The jets may expel a liquid coolant stream to cool a semiconductor device with a radial impingement pattern so that the liquid coolant travels from a central portion of the semiconductor surface to a peripheral portion of the semiconductor surface. Other embodiments are described and claimed.