It is an object of the present invention to provide a method for forming a
layer having functionality including a conductive layer and a colored
layer and a flexible substrate having a layer having functionality with a
high yield. Further, it is an object of the present invention to provide
a method for manufacturing a semiconductor device that is small-sized,
thin, and lightweight. After coating a substrate having heat resistance
with a silane coupling agent, a layer having functionality is formed.
Then, after attaching an adhesive to the layer having functionality, the
layer having functionality is peeled from the substrate. Further, after
coating a substrate having heat resistance with a silane coupling agent,
a layer having functionality is formed. Then, an adhesive is attached to
the layer having functionality. Thereafter, the layer having
functionality is peeled from the substrate, and a flexible substrate is
attached to the layer having functionality.