A polishing apparatus is used for polishing a workpiece such as a
semiconductor wafer to a flat mirror finish. The polishing apparatus
comprises a turntable having a polishing surface, a top ring for holding
a workpiece and pressing the workpiece against the polishing surface to
polish the workpiece, at least three cleaning apparatuses for cleaning
polished workpieces, and a transfer structure for transferring the
polished workpieces between at least three cleaning apparatuses. The
polishing apparatus further includes a rotary transporter disposed in a
position which can be accessed by said top rings and having a plurality
of portions positioned on a predetermined circumference from a center of
rotation of the rotary transporter for holding the workpieces.