The present invention discloses an electronic device package and a method
of the package. In particular, an electronic device package and a method
of the package suitable for a bumpless electronic device package with
enhanced electrical performance and heat-dissipation efficiency are
disclosed. The method comprises: providing a substrate having a plurality
of vias and a plurality of electronic devices; forming a gluing layer on
a surface of the substrate and fixing the electronic devices on the
gluing layer, wherein the electronic devices have I/O units aligned with
the vias respectively; forming a plurality of fixing layers in the gaps
between the electronic devices; trenching a plurality of openings aligned
with the vias respectively in the fixing layer; forming a plurality of
metallic conductive units in the vias, the openings and part of the
surface of the substrate; and forming a passivation layer over the other
surface of the substrate.