The present invention relates to an apparatus and method for economic treatment of Geldhart class C or larger substrate powders of single or plural metal, ceramic, or polymeric materials. In particular, the present invention is directed to coating such powder via a fluidized CVD or PVD, electroless, electrochemical, or solution chemistry plating process, and provides processes and apparatus for accomplishing same. It is particularly suited to coating with single or plural layers of metal, ceramic, binder, sintering aid, or polymer onto such materials without agglomeration. The coated particles and products made therefrom exhibit novel physical properties that are not limited by classical chemical and thermodynamic constraints.

 
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> Sulfur barrier for use with in situ processes for treating formations

> Release agents comprising hydrophobic, nanoscalar particles, and the use of these mold release agents

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