An electronic device can include a substrate (12) having a primary surface (14), a second surface (16, 22) opposite the primary surface (14), and an electrode (50). In one embodiment, the electrode (50) can lie adjacent to the second surface (22) and include, a barrier layer (54) lying between a conductive layer (56) and a metal-containing layer (52), wherein the metal-containing layer (52) includes a first metallic element and not a second metal element, and the barrier layer (54) includes the second metal element and not the first metallic element. In another embodiment, an adhesion layer (52) and a conductive layer (56) can each include a metallic element, and lie immediately adjacent to a barrier layer (54). In still another embodiment, a process for forming an electronic device can include removing a portion of the substrate (12) opposite a primary surface (14).