A Light-emitting diode which comprises a pair of metal plate leads connected to a light-emitting element. The pair of metal plate leads comprise, at the edges of the metal plates, surface mounting-type connecting parts that connect facing the pads of a circuit substrate. Furthermore, the light-emitting diode comprises a support member that has a part, other than leads, that contacts the circuit substrate so that it can be positioned on the circuit substrate with stability during the reflow process.

 
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