A light-emitting diode (LED) package structure including an encapsulant, a carrier, and an LED chip is provided. The encapsulant has a cavity located in a front end of the encapsulant. The carrier includes a die pad, a heat spreader, and a plurality of leads. The die pad is disposed on the encapsulant and located in the cavity. The heat spreader is connected with the die pad, and passes through the encapsulant to extend outside the cavity, and further extends toward a rear end of the encapsulant. The leads pass through the encapsulant and extend outside the cavity. The LED chip is disposed on the die pad, and is electrically connected to the leads. Heat generated when the LED chip emits light is conducted to the heat spreader via the die pad, so as to conduct the heat outside the encapsulant, and to further reduce the temperature of the LED chip.