A process carrier is capable of supporting printed circuit boards during manufacturing and testing. The process carrier includes a base plate, a first top plate and a second top plate. The base plate has an upper surface including a recessed area sized to receive a panelized group of printed circuit board substrates and a lower surface. The first top plate is coupleable to the upper surface of the base plate during a first manufacturing process. The first top plate includes a plurality of connected rails configured to secure the panelized group of printed circuit board substrates. The second top plate is coupleable to the upper surface of the base plate during a second manufacturing process. The second top plate is configured to cover the panelized group of printed circuit board substrates.