A nano-sized metal particle composite includes a first metal that has a
particle size of about 50 nanometer or smaller. A wire interconnect is in
contact with a reflowed nanosolder and has the same metal or alloy
composition as the reflowed nanosolder. A microelectronic package is also
disclosed that uses the reflowed nanosolder composition. A method of
assembling a microelectronic package includes preparing a wire
interconnect template. A computing system includes a nanosolder
composition coupled to a wire interconnect.