A heat dissipating package structure includes a chip carrier; a
semiconductor chip mounted and electrically connected to the chip
carrier; a heat spreader having a first surface, an opposed second
surface and a hollow structure, the second surface of the heat spreader
being mounted on the chip, wherein the chip is larger in size than the
hollow structure such that the chip is partly exposed to the hollow
structure; an encapsulant formed between the heat spreader and the chip
carrier, for encapsulating the chip, wherein the first surface and sides
of the heat spreader are exposed from the encapsulant to dissipate heat
produced from the chip; and a plurality of conductive elements disposed
on the chip carrier, for electrically connecting the chip to an external
device. The present invention also provides a method for fabricating the
heat dissipating package structure.