A stacked integrated circuit assembly includes a substrate having a top surface with at least one substrate connection pad. A first flip chip integrated circuit (FFIC) is disposed above the substrate, and a second flip chip integrated circuit (SFIC) is disposed above the FFIC. The FFIC is disposed between the substrate and the SFIC. The stacked integrated circuit assembly includes least one solder connection between the substrate connection pad and the FFIC and at least one solder connection between the FFIC and the SFIC.

 
Web www.patentalert.com

< Structures and methods for an application of a flexible bridge

> System for and method of positioning cells and determining cellular activity thereof

> Nanofilm compositions with polymeric components

~ 00553