Polyarylenesulfide resin compositions are provided having a dramatically improved adhesiveness with regard to the cured epoxy resin, while maintaining characteristics of polyarylenesulfide resins such as a heat resistivity and a chemical resistivity. The above described polyarylenesulfide resin compositions are obtained by comprising as essential components the allylenesulfide resin (A), bisphenol-type epoxy resin (B), and an oxazoline-group-containing amorphous polymer (C). The thus obtained polyarylenesulfide resin compositions can be used as superior engineering plastics in wide application fields such as electronic and other devices.