A device package structure includes: a base body having a conductive connection portion and a level difference portion; a device arranged on the base body, having a connection terminal electrically connected to the conductive connection portion via the level difference portion on the base body; and a connector electrically connecting the connection terminal and the conductive connection portion, having substantially the same height as a height of the level difference portion.

 
Web www.patentalert.com

< Semiconductor device and manufacturing method thereof

> Wafer level assemble chip multi-site testing solution

> Method to accurately estimate the source and drain resistance of a MOSFET

~ 00547