Disclosed herein is a method of making a light emitting device comprising an LED and a molded silicon-containing encapsulant. The method includes contacting the LED with a photopolymerizable composition containing a silicon-containing resin having silicon-bonded hydrogen and aliphatic unsaturation and two metal-containing catalysts. One catalyst may be activated by actinic radiation, and the second by heat but not the actinic radiation. Polymerization of the photopolymerizable composition to form the encapsulant may be carried out by selectively activating the different catalysts. At some point before polymerization is complete, a mold is used to impart a predetermined shape to the encapsulant.

 
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~ 00546