A compound heat sink for the removal of thermal energy useful for, inter alia, electronic devices or other components. The compound heat sink includes a die cast base element; an extruded dissipation element having a thermal conductivity of at least about 150 W/m-K; and a thermal connection material positioned between and in thermal contact with each of the base element and the dissipation element, wherein the thermal connection material having an in-plane thermal conductivity greater than the thermal conductivity of the dissipation element.

 
Web www.patentalert.com

< Rice promoters for regulation of plant expression

> Yield and stress tolerance in transgenic plants

> 6-(poly-substituted aryl)-4-aminopicolinates and their use as herbicides

~ 00545