The present invention provides methods for conformally or superconformally
coating and/or uniformly filling structures with a continuous, conformal
layer or superconformal layer. Methods of the present invention improve
conformal or superconformal coverage of surfaces and improve fill in
recessed features compared to conventional physical deposition and
chemical deposition methods, thereby minimizing formation of voids or
gaps in a deposited conformal or superconformal layer. The present
methods are capable of coating or filling features useful for the
fabrication of a broad class of electronic, electrical and
electromechanical devices.