A printhead manufacturing method includes providing a first wafer, forming a polymer layer over the first wafer, the polymer layer including at least one via, providing a metal layer over the at least one via, providing a solderable or plateable interface layer over the metal layer and the polymer layer, forming a fluid chamber in the polymer layer, providing a fluid nozzle in the first wafer, providing a second wafer, and joining the second wafer to the first layer to form the printhead. A printhead that includes a first wafer, a polymer layer over the first wafer, the polymer layer including at least one via, a metal layer over the at least one via, an interface layer over the metal layer and the polymer layer, a fluid chamber formed in the polymer layer, and a fluid chamber formed in the first wafer.