Described is a method of reducing corrosion of a silver-containing surface comprising electro-depositing a layer of an iodine-containing material on the silver-containing surface at a charge density of about 80 mA*s (milliamps second)/cm.sup.2 or less. Also described is an electrical contact also produced by the method.

 
Web www.patentalert.com

< Heterocycle grafted monomers and related polymers and hybrid inorganic-organic polymer membranes

> Process for electrolytically plating copper

> Apparatus and method for removing sulfur containing compounds from a post-refinery fuel stream

~ 00541