The present invention relates to a simulated wood surface covering which is particularly useful in decking and flooring applications, said simulated wood surface covering being comprised of strips adapted to be interconnected aside of each other thereby forming an assembled simulated wood surface covering of desired dimensions to cover a substrate, wherein the strips are comprised of a simulated wood composition which is comprised of polyvinyl chloride, a non-migrating plasticizer, and a coloring agent, wherein the strips have sufficient flexibility to conform to curved surfaces and to surface irregularities, wherein the upper surface of the strips are roughened to imitate the grain structure of wooden material, wherein the strips are void of longitudinal slots wherein a pressure sensitive adhesive covers the underside of the strips, and wherein the pressure sensitive adhesive is covered by a backing so that the pressure sensitive adhesive is sandwiched between the strips and the backing.