The invention provides metal compositions, including silver compositions,
and thermal imaging donors prepared with the compositions. The donors are
useful for thermal transfer patterning of a metal layers and optionally,
a corresponding proximate portion of an additional transfer layer onto a
thermal imaging receiver. The compositions are useful for dry fabrication
of electronic devices. Also provided are patterned multilayer
compositions comprising one or more base film(s), and one or more
patterned metal layers, including EMI shields and touchpad sensors.