The invention concerns an adhesive composition for producing thermoset
products, capable of being heated by means of an electric field, a
magnetic field, an electromagnetic field or an alternating
electromagnetic field, and containing filler particles which are
metallic, ferromagnetic, ferrimagnetic, superparamagnetic or
paramagnetic. Said adhesive composition can be hardened under the action
of heat to form a high-resistance stable adhesive assembly, said
resulting adhesive assemblies capable of being likewise dissociated under
the action of heat.