In a component insertion head, by grasping of a device portion of a component by a device chuck, a lead wire is stretched on a fulcrum given by a grasping position of the lead wire by a transfer chuck so that the device portion is placed at a component insertion position, by which correction of an insertion posture of the component is performed, and the lead wire of the component that has been corrected in terms of its insertion posture is inserted into an insertion hole of a board.