A fluid ejection device, including a substrate carrier having a substrate
receiving-surface, and a substrate having at least one fluid ejector
actuator disposed on the substrate. In addition the fluid ejection device
includes a one-part adhesive disposed between the substrate and the
substrate-receiving-surface. The one-part adhesive is an epoxy resin
having a polyglycidyl ether of a polyhydric phenol, a solid
cylcoaliphatic amine curing agent.