Automated handling systems and methods for using the handling systems for
handling a work piece in a machining process, for example, an electrical
discharge machining (EDM) process, are provided. The handling systems
include a robotic manipulator adapted to grasp a work piece and locate
the work piece in a machining operation, such as, an EDM machining
operation. The robotic manipulator includes tooling having gripping
devices adapted to grasp and position the work piece so that the work
piece can be transferred and positioned, for example, precisely
positioned, whereby accurate machining of the work piece can be practiced
with little or no custom tooling. Methods for handling a work piece are
also disclosed.