A thermal transfer device (20) comprises a housing having a base assembly
(23) and a cover (22). The base assembly (23) comprises a thermal
transfer base (25) and a fluid-porous, thermally conductive mesh
structure (26). The thermal transfer base (25) and the cover (22)
cooperate to define a thermal transfer chamber (24). The thermally
conductive mesh structure (26) is configured and positioned in the
chamber (24) to provide a tortuous, thermal conduction path for fluid
(e.g., a coolant) which turbulently travels from an inlet (40) of the
chamber to one or more outlets (42) of the chamber (24). In some
embodiments, the mesh structure comprises wires which are fused by
diffusion bonding into a mesh, in other embodiments the mesh comprises a
metallic wool. Within the chamber the mesh structure (26) can have
various configurations for providing an exposure interface between fluid
pumped through the chamber and the mesh.